Advanced Inquiry Systems, Inc. (AISI) announced today that it has closed an $11 million Series B financing with all its current investors participating. With this funding, AISI plans to complete customer validation of its game-changing full wafer data sensing systems for semiconductor memory manufacturing.
The company also announced it has received a purchase order for its first DRAM (DDR3) products from a large, Asia-based semiconductor memory manufacturer.
The company has developed a proprietary silicon based platform that will enable lower cost testing of memory devices. The technology is unique in the test world as it is able to operate at very high speeds improving tester utilization through parallelism and it can scale both in pin density and wafer size. It is a new category of making complete contact with the entire wafer under test that leverages low cost and high signal integrity to bring intelligence at the wafer for early detection of product performance, reliability and quality.
“The continued support of our world-class investor team validates the strength of AISI’s vision and the growing momentum behind bringing our technology to market,” said Michael Wright, president and CEO, AISI. “Our investors recognize that AISI has immense potential, with an opportunity to serve an established growth market. This round of funding will provide AISI the capital required to reach its next significant milestone – customer validation of full wafer test.”
AISI investors who participated in the current round of financing include OVP Venture Partners, TL Ventures, Intel Capital, Applied Ventures, KT Ventures and Northwest Ventures.
The company also announced it has received a purchase order for its first DRAM (DDR3) products from a large, Asia-based semiconductor memory manufacturer.
The company has developed a proprietary silicon based platform that will enable lower cost testing of memory devices. The technology is unique in the test world as it is able to operate at very high speeds improving tester utilization through parallelism and it can scale both in pin density and wafer size. It is a new category of making complete contact with the entire wafer under test that leverages low cost and high signal integrity to bring intelligence at the wafer for early detection of product performance, reliability and quality.
“The continued support of our world-class investor team validates the strength of AISI’s vision and the growing momentum behind bringing our technology to market,” said Michael Wright, president and CEO, AISI. “Our investors recognize that AISI has immense potential, with an opportunity to serve an established growth market. This round of funding will provide AISI the capital required to reach its next significant milestone – customer validation of full wafer test.”
AISI investors who participated in the current round of financing include OVP Venture Partners, TL Ventures, Intel Capital, Applied Ventures, KT Ventures and Northwest Ventures.
