Monday 27 July 2009

RF Hardware Developer Rayspan raise $12.5M

PRESS RELEASE

Rayspan Corporation, the world’s leading innovator of metamaterial air interface solutions for wireless communications, today announced that it has received US$12.5M in a Series B financing led by new investor Khosla Ventures, who was joined by existing Rayspan investor Sequoia Capital as well as individual private investors. The financing will be utilized by Rayspan to accelerate and expand the development and commercialization of its breakthrough metamaterial wireless technology.

“Rayspan is on track to global leadership in developing and commercializing the exciting new field of metamaterials for wireless communications,” said Pierre Lamond, General Partner at Khosla Ventures. “Their advanced and proprietary technology is strongly differentiated and market-proven, and we believe they will become an industry-leading air interface provider in the huge wireless markets they target.”
“Rayspan is delighted to have Khosla Ventures join its shareholders,” said Franz Birkner, CEO of the company. “Their support, together with that of Sequoia Capital, is a clear vote of confidence in Rayspan’s exciting opportunity to broadly deploy its breakthrough metamaterial air interface solutions in the world’s largest WLAN and 2/3/4G cellular handset markets.”
About Rayspan
Founded in 2006, Rayspan is the world’s leading innovator of metamaterial air interface solutions for wireless communications. Metamaterials provide breakthrough improvements in antenna and RF front-end component miniaturization, performance, cost reduction and ease of manufacture. Rayspan’s solutions support a full range of fixed and mobile wireless WAN and LAN applications including all 2/3/4G cellular handsets, WiFi, Bluetooth and GPS.
To learn more about Rayspan Corporation visit http://www.rayspan.com .